简体中文

UAV

Lightweight packaging

Simpler peripheral

Higher current density

Uav has a broad market prospect because of its small size, small size, light weight, large functional range and outstanding advantages such as harsh environment operation, strong mobility and easy operation. At the same time, UAV technology has also turned to miniaturization, miniaturization, high-speed long-term navigation, and network clustering.


  Innovision Semiconductor Inc. has introduced an extensive power chip solution for powering drones. For the compact, efficient and lightweight application requirements of the UAV, the chip application with higher current density, less peripheral space, more rich functions and lighter packaging is introduced, which ensures stable power output, high efficiency and good heat dissipation while meeting the above conditions.



Key products

Products Key Words